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...We can be confident that we have a reliable and competitive product. Teradyne looks forward to a continued technology partnership with DDi”

Thomas Felding, VP of New Product Introduction, Teradyne, Inc., ATE Operations on a recent laminate testing program for lead-free assembly.



Choose the Right Technology Solution for Your Application.
One of the largest and most diverse customer bases in the industry turns to DDi because of our focus on cutting-edge applications, innovative technologies, and product development of the highest standards. However, we understand that the latest and most advanced technologies are not right for every application. So we offer a full range of capabilities across all technology levels — and help you find just the right solution for your needs. If your product line is diverse or your production plan calls for simple initial designs before moving into more advanced models, you know that DDi can assist you at every step.

When designing your PCB, it’s important to choose the right technology and balance functionality with performance, reliability, cost, and time. We offer three different technology levels to best suit your needs:


Our standard technology is tried and true, very cost-effective, and delivers performance without fancy bells and whistles. Whenever possible, we recommend designing products to use this technology, as it won’t require special handling or additional engineering support, and will ensure the fastest prototyping turn-around times. Plus, when you get to product launch, you’ll have access to a broad range of production resources to support higher volume runs.
Learn more about DDi Standard Level Technology



Advanced solutions are more complex than standard technology, as they often incorporate complex chip sets, such as finer pitch BGAs, and have requirements that limit PCB size, at the same time requiring more functionality. While offering more higher technology features and innovations, our advanced solutions are based on proven, reliable designs. Achieving this higher performance requires more support and time from our front-end and process engineering teams, more complex set-ups, and more processing steps. This, in turn, adds to leads times and your overall costs.
Learn more about DDi Advanced Level Technology



PCB’s that incorporate even more advanced chip set solutions, such as 0.4 mm – 0.8 mm BGAs, flip chips, and substrates, require engineered technology solutions. This higher complexity stems from the need for more functionality, speed, drive size — all requiring more specialized materials, higher density, and tighter tolerances. Ideally, DDi will partner with you during the early design phase to ensure that the technology you use will be manufacturable. Keep in mind that engineered projects require intense engineering resources and time, and yields typically are lower because of this attention to detail.
Learn more about DDi Engineered Level Technology


Research & Development
Developing new technologies takes a great amount of expertise and experience. The DDi engineering team is available to help you design a solution from concept through implementation. This often entails designing new processes to support these designs and several months to develop and test the new processes to ensure a successful outcome.
Learn more about DDi Research & Development

Key Technology Manufacturing Factors
There are several manufacturing elements that have an impact on board cost, delivery time and manufacturability. We have taken these aspects and rated them as Standard, Advanced and Engineered. Now when you design your PCB you can anticipate potential cost-drivers, process difficulties, yield loss and delivery issues.
Learn more about DDi Key Technology Manufacturing Factors