Sales Associate LOGIN
DDi logo
DDi logoCompanyInvestor RelationsEventsServicesPressContactCustomer Support
Put DDi on your side!
Join forces with the industry’s leading PCB team. Seasoned engineers and production specialists who understand the challenges and the processes necessary to overcome them and make your product a success. Experience really does make a difference.



DDi - Design Group
DDi’s award-winning Design Group team has expertise in the design and reverse engineering of commercial as well as Military & Aerospace interconnects. DDi's Design Group is a key component of our "one-stop" strategy which emphasizes the provision of value added services to leading electronic interconnect developers and users.

The Design Group has a total solutions focus from mechanical guidance to the design of complex, high density, high reliability PCB's, optimized for the manufacturing, assembly and test domains. DDi’s Design Group is comprised of IPC certified designers (CID or CID+) who receive ongoing intensive education. The Design Group utilizes Mentor Graphics PADS as the primary design tool.

Non-Destructive Reverse Engineering:
  • Do you have legacy circuit boards that you source from a single vendor because they hold the only gerber files?
  • Do you have any populated or non-populated circuit boards and don’t have the files to fabricate more of them?
  • Do you have legacy circuit boards that require obsolete parts to be replaced, but don’t have any files to complete the modifications?

DDi Design can supply:

  • A fully complete logical design (designed to meet the IPC 6012 specification)
  • Complete set of gerber or ODB fabrication files
  • IPC-356 & ASCII files for fab & assembly
  • Master drawing complete with Fab Stack-up
  • Complete set of Schematics

Benefits of DDi Reverse Engineering:

  • Supply electronic files for any future modification of fabrication needs
  • Improve design to today’s design standards
  • Improve fabrication yield by designing to DDi Design Group standards
  • Improve fabrication panel utilization to reduce board costs
  • Possibly design the board in fewer layers to reduce overall board costs

The Design Group has extensive experience in design incorporating the following technologies:
  • High Layer Count
  • Rigid-Flex
  • Flex
  • High Density Interconnect (HDI) including both blind and buried vias
  • Microvia
  • Controlled Impedance
  • Embedded Passives
  • Micro BGA
  • Backpanels
  • PCBCIA
  • Thermal Management including heatsinks
  • EMI and EMC control
  • Stepped & Cavity construction
  • Compact PCI
  • PMC
  • PCIe
  • DDR2 and newer Memory

DDi's Design Group has completed thousands of designs for aerospace, telecom, automotive, medical and consumer product companies in Canada, the EU and the USA.

 

Design Group Manager

Rich Buitendyk
Kitchener, ON
Canada, N2G 2P1
Tel: 519-489-2142
Cell: 519-580-5406
rbuitendyk@ddiglobal.com

Contact Info:
If you are interested in DDi Design Group's services we can be contacted at: