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Many designs look great during the conceptual stage. However, when they get to production, they can be unrealistic, excessively costly, or even impossible. DDi avoids such surprises with our collaborative engineering process.

Find out more about our Engineering Process.



High Density Interconnects
These days, electronics companies demand smaller, faster, thinner products with enhanced functionality. And DDi’s pioneering Microvia and Stacked MicroVia (SMV) technologies deliver, making it possible to produce a wide range of products, from handheld electronics like Apple’s iPod Nano, camera phones, navigation systems and computers to medical devices, sonar to wireless LAN and reference designs for fine pitch chip sets.

SMV Value Proposition
Layer
Count
Layer
Reduction
Layer
Reduction
Value
Add
4 – 8 2 20% signal integrity
10 – 14 4 30% fan-out
16 – 20 6 50% trace
density
22 – 26 8 75% TS, FO, SI
2 + N + 2 Typical Efficiencies