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Pb Free RoHS Compliant Solutions
DDi in conjunction with select OEMs conducted tests on 9 different FR4 materials to determine which were thermally robust enough to survive the higher temperatures of Lead Free Assembly. The tests included Thermal Stability, Peel Strength, Solder Float, Electrical, Interconnect Stress, Highly Accelerated Thermal Shock, and Conductive Anodic Filament Growth.
Our RoHS Compliance Statement can be found here.
Three major groups for Pb Free Assembly
| Group |
PCB Thickness |
Reflow Peak |
Time above Reflow |
| Group A |
Up to .062” |
No greater than 245° C |
30 to 60 seconds |
| Group B |
Up to .125” |
No greater than 260° C |
60 to 90 seconds |
| Group C |
.187” or greater |
No greater than 288° C |
90 to 120 seconds |
| Material |
Resin System |
TG |
Dk |
GHz |
Df |
| Nelco N4000-11 |
Multifunctional |
175° C |
4.1 |
1 GHz |
0.020 |
| Isola FR-370 HR |
Multifunctional |
180° C |
4.04 |
2 GHz |
0.021 |
| Hitachi MCL-E-679 |
High Tg FR-4 |
183° C |
4.3 |
1 GHz |
0.021 |
| Nelco N4000-29 |
Multifunctional |
185° C |
4.3 |
1 GHz |
0.015 |
High Performance FR-4 Group A
| Material |
Resin System |
TG |
Dk |
GHz |
Df |
| Nelco N4000-13 EP™ * |
Enhanced Multifunctional |
210° C |
3.7 |
1 GHz |
0.009 |
| Isola IS620 ** |
Modified Epoxy |
215° C |
3.78 |
1 GHz |
0.009 |
* Single lamination only
** Manufacturing challenge, Narrow processing window |
| Material |
Resin System |
TG |
Dk |
GHz |
Df |
| Isola FR-370 HR |
Multifunctional |
180° C |
4.04 |
2 GHz |
0.021 |
| Hitachi MCL-E-679 |
High Tg FR-4 |
183° C |
4.3 |
1 GHz |
0.021 |
| Nelco N4000-29 |
Multifunctional |
185° C |
4.3 |
1 GHz |
0.015 |
- Surface Finish: OSP, Immersion Gold, Immersion Silver
- Solder Mask: Taiyo PSR4000BN Black, Blue, Clear, Red, White, Yellow, Green
- Legend: Enthone 10 Series (105 white), Enthone 50 Series (black and blue)
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