Enabling Technology for Next Generation Printed Circuits: 06/24/10 - 06/24/10

Please join us for a special PCB workshop, we will be featuring a seminar and discussions on the following:

Laser Direct Imaging (LDI), Laser Drilling, Optical Drill & Rout

FLAT-WRAP™ Technology (wrap plating solution)

Thermal Management—Copper Core/STABLCOR® Material Solid Copper Via (ThermalVia™)

Deep Blind Vias (DpBV™)

Microvia Technology Standard Microvias, Stacked MicroVias (SMV™) Deep MicroVias (DpMV™), Deep Stacked MicroVias (DpSMV™)

Next Generation Stacked MicroVias (NextGen-SMV™) 3G-SMV™, HDI-Link™, Sub-Link™

Please RSVP to Lisa Keable @ lkeable@ddiglobal.com