Next Generation PCB Design Workshop
Salt Lake City, Utah 02/24/10 - 02/24/10
Challenges & Solutions for today's PCB's and Navigating Fine Pitch BGA Designs
Please join us for a special PCB Design workshop in Salt Lake City. We will be featuring information sessions and discussions conducted by our Senior Field Application Engineer, Mark Orzech, on the following subjects:
- Choosing the right PCB Materials
- Determining Construction and Via Path
- Use of Blind and Buried Vias, Flat-Wrap™ Technology
- Next Generation PCB Structures
- MicroVia, Deep MicroVia, Stacked MicroVia™
- Routing Techniques for Fine Pitch BGA Devices
- 0.5 mm, 0.4 mm, 0.3 mm and 0.25 mm
- Avoiding Cost Drivers
Seats are Limited, RSVP now for more information:
Mark Rodgers - mrodgers@ddiglobal.com
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We invest millions each year in research and development and collaborate with leading industry partners so that you can achieve your goals of creating next-generation products faster, easier, and with superior results. 
DDi Corporate Headquarters 1220 Simon Circle, Anaheim, CA 92806 Tel: (714) 688-7200 Fax: (714) 688-7400